Advanced laser solutions for interconnect and component production.
Blind, through-hole, and stepped vias
Rigid, flex, and rigid-flex materials
Green tape and advanced materials
Cutting, routing, and circuit excising
Kiss cutting polyimide / adhesive coverlay
Skiving to buried fiducials
Solder mask defect repair
ProVia FP-UC Dual-laser hybrid (UV + CO2) system for total process capability in copper clad laminates
ProVia FP-C CO2 laser system for dielectric and thin copper processing
ProVia FP-U UV laser system for superior drilling and cutting quality in copper and dielectrics
Smallest footprint with integrated autoloader
Dual-head, dual-panel processing
Trim and Test
Thin-film and thick-film resistor trimming
Embedded passives trim and test
Circuit and substrate testing
Marking, drilling and cutting operations
RapiTrim-IR Flying Probe Trim and Test system with high reliability fiber laser
RapiTrim-C Full-capability trimmer in a compact footprint for smaller format substrates.
RapiTrim-UV Flying Probe Trim and Test system with high power UV laser capable of a wide range of material processing applications.
Advanced automated calibration techniques yield superb feature placement accuracy.
Precise control over laser pulses and where they go provides unmatched process quality, consistency and stability.
Advanced tool parameters provide total control over how the laser dose is delivered to each feature.
Multiple process steps per feature allows for expanded process capability, including multi-pass and multi-layer operations without additional programming.
1051 Baxter Road, Ottawa, Ontario, Canada K2C 3P2 Tel: +1-613-236-8359 email@example.com
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