Advanced laser solutions for interconnect and component production.
Blind, through-hole, and stepped vias
Rigid, flex, and rigid-flex materials
Green tape and advanced materials
Cutting, routing, and circuit excising
Kiss cutting polyimide / adhesive coverlay
Skiving to buried fiducials
Solder mask defect repair
ProVia FP-UC Dual-laser hybrid (UV + CO2) system for total process capability in copper clad laminates
ProVia FP-C CO2 laser system for dielectric and thin copper processing
ProVia FP-U UV laser system for superior drilling and cutting quality in copper and dielectrics
Smallest footprint with integrated autoloader
Dual-head, dual-panel processing
Trim and Test
Thin-film and thick-film resistor trimming
Hybrid circuit trim and test
Embedded passives trim and test
Circuit and substrate testing
Marking, drilling and cutting operations
Two machine formats:
RapiTrim-C Hybrid circuit trim and test
RapiTrim Large format version for full-size PCBs
both with optional full automation.
Three wavelength options:
RapiTrim-IR Thick / thin film processing using 1064nm IR wavelength.
RapiTrim-G Thin film processing using 532nm green wavelength.
RapiTrim-UV Thin film processing and micromachining using 355nm UV wavelength.
Advanced automated calibration techniques yield superb feature placement accuracy.
Precise control over laser pulses and where they go provides unmatched process quality, consistency and stability.
Advanced tool parameters provide total control over how the laser dose is delivered to each feature.
Multiple process steps per feature allows for expanded process capability, including multi-pass and multi-layer operations without additional programming.
1051 Baxter Road, Ottawa, Ontario, Canada K2C 3P2 Tel: +1-613-236-8359 firstname.lastname@example.org
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