Advanced laser solutions for interconnect and component production.
Drilling, Cutting, Skiving
Trim and Test
From microvias and cavity formation to coverlay patterning, PPI has the application experience to help you Improve Productivity.
Automatically drill not only single-layer but also double-layer (stepped) blind vias and through holes.
Machine through Cu and dielectric without damage to buried tracks or pads.
Solder Mask Repair
Panels with mistakes in solder mask can be salvaged by solder mask removal with either the CO2 or UV laser.
Kiss cuts through polyimide/adhesive coverlay allow waste material to stay after peeling away cut pattern.
Flex circuit processing
Usually polyimide and copper, often with acrylic adhesive. Typical processes include drilling, cutting and skiving.
Directly structure even thin Cu with little damage to underlying materials.
High accuracy laser trim. Precision process control. No Probe Cards.
Thick Film and Thin Film resistors on virtually any substrate, RapiTrim systems are optimized for advanced hybrid and embedded passives materials. IR, green, or UV lasers are available.
Single- and double-plunge trims in thin-film material
Double-plunge and L-vernier trim in thick-film material
Serpentine trims in thin-film and thick-film material
Symmetric shave trim in thin-film and asymmetric shave trim in thick-film material
Precision Trim Control
Green laser used for high precision symmetric scan trims (left) and ladder rungs followed by serpentine trims (right) in thin film materials.
Flying Probe Measurement
Proprietary Flying Probe technology achieves volume production throughput with no limitations on design rules or test pad density
Automated DXF Import
Intuitive graphical user interface streamlines job creation from DXF and other data sources, linking components with trim / measurement libraries
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