Advanced laser solutions for interconnect and component production.
The Applications Lab team at PPI have a wealth of experience in laser processing. They will help you choose the right laser for your application, whether HDI microvia drilling, or kiss-cutting polyimide coverlay.
For polyimide or other non-reinforced dielectrics, the UV laser alone may provide your solution. With the glass-reinforced dielectrics of rigid boards, the hybrid version with both laser sources is the best choice. The high peak power pulses of the CO2 laser can also be used for drilling of small vias directly through both the top Cu and dielectric. In general, the CO2 laser is appropriate for high speed drilling, cutting and skiving of dielectrics, while the UV laser is able to machine copper and provide higher process quality in many dielectrics.
Automatically drill not only single layer vias but also double layer (stepped) blind vias and through holes using a combination of UV and CO2 lasers.
Machine through top copper with the UV laser and then the dielectric without damage to buried tracks or pads. A final process step with weak UV cleans the lower Cu layer without damage.
Green ceramic tape is easily drilled, cut or depth-machined with either the UV or CO2 laser.
Drill directly into thin Cu with CO2 down to a 40 um diameter with or without black oxide.
Usually performed on polyimide and copper. Typical processes include drilling, cutting and skiving.
Directly structure Cu (including thin versions) using the UV beam with little damage to underlying materials.
Kiss cuts through polyimide / adhesive coverlay.
Panels with mistakes in solder mask can be salvaged by solder mask removal with either the CO2 or UV laser.
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Laser Drilling and Cutting
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