Advanced laser solutions for interconnect and component production.

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Applications:

PCB and Flex Drilling & Cutting

From microvias and cavity formation to coverlay patterning, PPI has the application experience to help you improve productivity.

The Applications Lab team at PPI have a wealth of experience in laser processing.  They will help you choose the right laser for your application, whether HDI microvia drilling, or kiss-cutting polyimide coverlay.  For polyimide or other non-reinforced dielectrics, the UV laser alone may provide your solution.  With the glass-reinforced dielectrics of rigid boards, the hybrid version with both laser sources is the best choice. The high peak power pulses of the CO2 laser can also be used for drilling of small vias directly through both the top Cu and dielectric.  In general, the CO2 laser is appropriate for high speed drilling, cutting and skiving of dielectrics, while the UV laser is able to machine copper and provide higher process quality in many dielectrics.

HDI Microvias

Automatically drill not only single-layer but also double-layer (stepped) blind vias and through holes using a combination of UV and CO2.

Flex Circuit Processing

Usually polyimide and copper, often with acrylic adhesive.  Typical processes include drilling, cutting and skiving.

Cavity Formation

Machine through top copper with the UV and then the dielectric without damage to buried tracks or pads.  A final process step with weak UV cleans the lower Cu layer without damage.

Structure Copper

Directly structure even thin Cu using the UV beam with little damage to underlying materials.

CO2 Direct Drilling

Drill directly into thin Cu with CO2, down to 40um diameter, with or without black oxide.

Solder Mask Repair

Panels with mistakes in solder mask can be salvaged by solder mask removal with either the CO2 or UV laser.

Green Tape

Green ceramic tape is easily drilled, cut or depth-machined with either the UV or CO2 laser.

Coverlay

Kiss cuts through polyimide/adhesive coverlay.

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