Advanced laser solutions for interconnect and component production.

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ProVia™ FP-U

Drilling & Cutting System

Laser PCB Drilling and Cutting System

Single UV laser system, providing high speed processing of copper, and high quality drilling and cutting of dielectric material.

 

ProVia FP-U laser drilling systems are able to machine copper and provide higher process quality in many dielectrics.

 

System Features Include:

  • Intuitive Graphical User Interface with ProSys operating software.
  • Advanced Beam Positioning and Laser Pulse Control provide high throughput, accuracy, and process stability.
  • Auto-Calibration functions ensure repeatable quality.
  • Extensive System Diagnostics continuously monitor all critical components and machine performance.
  • Sealed Beam Delivery protects optics from process debris, extending component lifetimes
  • Touchscreen operation (full HD size).
  • Automatic Run-time Calibration means no operator intervention is required for an entire batch.

 

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         ProVia FP-U Datasheet

 

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         Software Package

 

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Optional Features and Hardware

 

Autoloader

Complete automation allows for trays of panels to be loaded into the system (side pods shown above and detail left).  Panels are loaded by vacuum pickup.

 

Alternate compact autoloader within the core system footprint (shown below).

 

Both schemes have configurable pickup vacuum zones.

 

Slipsheet pass-through handling for both autoloader styles.

 

Configurable for large panel and continuous web processing

Compatible with roll-to-roll web handlers

Integrated inspection microscope

A 2.3MP HD colour camera can inspect microvias after processing. Zoom optics are designed for viewing microvias in the 50 - 200 µm diameter range.  On-screen measurements can be made and images saved for later use.  Powerful white LED light sources provide both coaxial and low angle ring illumination.

Laser PCB Drilling System integrated inspection microscope

Flat-top beam homogenizer and zoom telescope

As an alternative to the normal Gaussian intensity profile, flat-top CO2 spots permit drilling and pocketing operations with a very consistent process and less risk of sensitive inner layer damage.  The user can even switch between Gaussian and flat-top spots within the same job.

Laser PCB Drilling System flat-top homogenizer and zoom telescope.

Dual-head, dual-panel drilling

The single-laser systems (UV-only, CO2-only) can be configured with two independent galvo stations and two vacuum tables for dual-panel operation.  The ProVia software is highly adaptable, able to process different jobs independently on two panels through two galvo heads.

Laser PCB Drilling System dual head, dual panel driller

Panel thickness measurement probe

An ultra-reliable electro-mechanical height probe is available to measure / verify the panel thickness prior to processing.  Helps prevent drilling the wrong panels or with the wrong job.

Barcode or 2-D matrix code reading

Used for panel identification, and can be manual or automated.

Laser PCB Drilling System Barcode Reader

 

 

Networking software with automatic file retrieval and job creation

The system can even accommodate a tray of mixed panels, using optional OCR or barcode to read panel ID and load the appropriate job from files on the system or network.

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