Advanced laser solutions for interconnect and component production.

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ProVia™ FP-UC

PCB and Flex Drilling &

Cutting System

UV + CO2 'hybrid' laser system, providing the broadest capability with optimum speed.

 

ProVia FP-UC laser drilling and cutting systems are the hybrid version with both laser sources. The CO2 laser is appropriate for high speed drilling, cutting and skiving of dielectrics, while the UV laser is able to machine copper and provide higher process quality in many dielectrics.

 

System Features Include:

  • Intuitive Graphical User Interface with ProSys operating software.
  • Advanced Beam Positioning and Laser Pulse Control provide high throughput, accuracy, and process stability.
  • Auto-Calibration functions ensure repeatable quality.
  • Extensive System Diagnostics continuously monitor all critical components and machine performance.
  • Sealed Beam Delivery protects optics from process debris, extending component lifetimes
  • CO2 systems have Active Pulse Shaping to provide precise control on a pulse-by-pulse basis.
  • Touchscreen operation (full HD size).
  • Automatic Run-time Calibration means no operator intervention is required for an entire batch.

 

         Resources

 

          ProVia FP-UC Datasheet

 

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         Software Package

 

          ProSys Software for ProVia

Optional Features and Hardware

 

 

 

Autoloader

Complete automation allows for trays of panels to be loaded into the system (side pods shown above and detail left).  Panels are loaded by vacuum pickup.

 

Alternate compact autoloader within the core system footprint (shown below).

 

Both schemes have configurable pickup vacuum zones.

 

Slipsheet pass-through handling for both autoloader styles.

 

Configurable for large panel and continuous web processing

Compatible with roll-to-roll web handlers

Integrated inspection microscope

A 2.3MP HD colour camera can inspect microvias after processing. Zoom optics are designed for viewing microvias in the 50 - 200 µm diameter range.  On-screen measurements can be made and images saved for later use.  Powerful white LED light sources provide both coaxial and low angle ring illumination.

Flat-top beam homogenizer and zoom telescope

As an alternative to the normal Gaussian intensity profile, flat-top CO2 spots permit drilling and pocketing operations with a very consistent process and less risk of sensitive inner layer damage.  The user can even switch between Gaussian and flat-top spots within the same job.

Dual-head, dual-panel drilling

The single-laser systems (UV-only, CO2-only) can be configured with two independent galvo stations and two vacuum tables for dual-panel operation.  The ProVia software is highly adaptable, able to process different jobs independently on two panels through two galvo heads.

Panel thickness measurement probe

An ultra-reliable electro-mechanical height probe is available to measure / verify the panel thickness prior to processing.  Helps prevent drilling the wrong panels or with the wrong job.

Barcode or 2-D matrix code reading

Used for panel identification, and can be manual or automated.

 

 

Networking software with automatic file retrieval and job creation

The system can even accommodate a tray of mixed panels, using optional OCR or barcode to read panel ID and load the appropriate job from files on the system or network.

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