Advanced laser solutions for interconnect and component production.

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ProViaTM Laser Via Drilling & Cutting Systems

 

Laser drilling systems optimized for conventional and high performance materials, advanced packaging and embedded components in flex and rigid HDI PCBs.

Laser PCB Drilling and Cutting System

ProVia™ Drilling & Cutting Systems

ProVia systems are advanced volume production workstations for rigid, rigid-flex or flex panels, incorporating high performance beam positioning and laser control for high throughput drilling and routing of complex features.

 

Choose from Dual-laser (UV + CO2), UV, and CO2 lasers models

  • Single-laser systems available in dual-head, dual-panel processing configurations
  • All systems are roll-to-roll compatible
  • Standard or compact automation available

 

CO2 laser systems are appropriate for high speed drilling, cutting and skiving of dielectrics, while UV laser systems are able to drill and pattern copper and can provide higher process quality in many dielectrics.  Whether your application is with glass or organic reinforced epoxies or non-reinforced materials (resin-coated foil or polyimide), there is a ProVia model to meet your requirements.

Applications

 

Blind Via Drilling

Through-hole Via Drilling

Buried Via Drilling

Cutting, Routing, Patterning

Circuit Excising

Skiving

Cavity Formation

Defect Repair

 

 

         Request for Information

 

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         Systems

 

           ProVia FP-UC Datasheet

           ProVia FP-C Datasheet

           ProVia FP-U Datasheet

 

 

 

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         Software Package

 

         ProSys Laser Drilling Software

Common Micro Vias

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