Advanced laser solutions for interconnect and component production.
ProViaTM Laser Via Drilling & Cutting Systems
Laser drilling systems optimized for conventional and high performance materials, advanced packaging and embedded components in flex and rigid HDI PCBs.
ProVia™ Drilling & Cutting Systems
ProVia systems are advanced volume production workstations for rigid, rigid-flex or flex panels, incorporating high performance beam positioning and laser control for high throughput drilling and routing of complex features.
Choose from Dual-laser (UV + CO2), UV, and CO2 lasers models
CO2 laser systems are appropriate for high speed drilling, cutting and skiving of dielectrics, while UV laser systems are able to drill and pattern copper and can provide higher process quality in many dielectrics. Whether your application is with glass or organic reinforced epoxies or non-reinforced materials (resin-coated foil or polyimide), there is a ProVia model to meet your requirements.
Dual-laser (UV + CO2) laser drilling system providing the broadest capability with optimum speed.
High repetition rate, high peak power CO2 laser system for drilling and cutting dielectric material.
Blind Via Drilling
Through-hole Via Drilling
Buried Via Drilling
Cutting, Routing, Patterning
Common Micro Vias
PPI Systems Inc.
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