Advanced laser solutions for interconnect and component production.

ProVia Standard Features

Intuitive Graphical User Interface

with ProSys operating software - learn more

Advanced Beam Positioning and Laser Pulse Control provide high throughput, accuracy, and process stability

Auto-Calibration functions ensure repeatable quality

Continuously variable CO2 spot size using the programmable zoom telescope

Extensive System Diagnostics continuously monitor all critical components and machine performance

Sealed Beam Delivery protects optics from process debris, extending component lifetimes

CO2 systems have APSTM (Active Pulse Shaping) to provide precise control on a pulse-by-pulse basis

Touchscreen operation (full HD size)

Automatic Run-time Calibration means no operator intervention is required for an entire batch.

Laser Drilling systems optimized for conventional and high performance materials, advanced packaging, and embedded components

 

Blind and through-hole via drilling

Cutting, routing, and circuit excising

Skiving / cavity formation

Defect repair

Systems to suit any material and construction

ProVia FP-UC

Dual-laser (UV + CO2) system, providing the broadest capability with optimum speed

ProVia FP-C

High repetition rate, high peak power CO2 laser for drilling and cutting dielectric material

ProVia FP-U

High power UV laser for superior drilling and cutting quality

Optional Features and Hardware

Autoloader

Complete automation allows for trays of panels to be loaded into the system (side pods shown above and detail left).  Panels are loaded by vacuum pickup.

 

Alternate compact autoloader within the core system footprint (shown below).

 

Both schemes have configurable pickup vacuum zones.

 

Slipsheet pass through handling for both autoloader styles.

 

Configurable for large panel and continuous web processing

Compatible with roll-to-roll web handlers

 

 

Panel thickness measurement probe

 

An ultra-reliable electro-mechanical height probe is available to measure / verify the panel thickness prior to processing.  Helps prevent drilling the wrong panels or with the wrong job.

Integrated inspection microscope

A 2.3MP HD colour camera can inspect microvias after processing. Zoom optics are designed for viewing microvias in the 50 - 200 µm diameter range.  On-screen measurements can be made and images saved for later use.  Powerful white LED light sources provide both coaxial and low angle ring illumination.

Flat-top beam homogenizer and zoom telescope

 

As an alternative to the normal Gaussian intensity profile, flat-top CO2 spots permit drilling and pocketing operations with a very consistent process and less risk of sensitive inner layer damage.  The user can even switch between Gaussian and flat-top spots within the same job.

 

Networking software with automatic file retrieval and job creation

 

The system can even accommodate a tray of mixed panels, using optional OCR or barcode to read panel ID and load the appropriate job from files on the system or network.

Dual-head, dual-panel drilling

The single-laser systems (UV-only, CO2-only) can be configured with two independent galvo stations and two vacuum tables for dual-panel operation.  The ProVia software is highly adaptable, able to process different jobs independently on two panels through two or even four galvo heads.

Barcode or 2-D matrix code reading

 

Used for panel identification, and can be manual or automated.

1051 Baxter Road, Ottawa, Ontario, Canada  K2C 3P2               Tel:  +1-613-236-8359      info@ppisystems.com

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