Advanced laser solutions for interconnect and component production.
The RapiTrim-C-UV model is designed for multi-purpose and specialty applications. These include the trimming of thick- and thin-film resistors with narrow kerf, or applications with additional processing capability for materials such as copper, polyimide, ceramic (green tape, stackups or fired), FR4 and others.
Advanced laser and beam control, combined with available proprietary high-speed flying probe technology allows the RapiTrim systems to outperform older technology in both high volume production as well as low-volume, high-mix operations. Circuits can be as large as the substrate itself, and probing of dense designs is effortless, previously requiring multiple passes with multiple probe cards.
System Features Include:
PPI Systems Inc.
ProSys Laser Resistor Trimming Software
Laser Drilling and Cutting
Laser Resistor Trimming
ProSys Laser Drilling Software
PCB Drilling & Cutting
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Ottawa Application Lab
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