Systems

ProVia Laser Via Drilling and Cutting Systems

ProVia laser via drilling system

ProVia Drilling and Cutting Systems

ProVia systems are advanced volume production workstations for rigid, rigid-flex or flex panels, incorporating high performance beam positioning and laser control for high throughput drilling and routing of complex features.

Choose from Dual-laser (UV + CO2), UV, and CO2 lasers models

  • Single-laser systems available in dual-head, dual-panel processing configurations

  • All systems are roll-to-roll compatible

  • Standard or compact automation available

CO2 laser systems are appropriate for high speed drilling, cutting and skiving of dielectrics, while UV laser systems are able to drill and pattern copper and can provide higher process quality in many dielectrics.  Whether your application is with glass or organic reinforced epoxies or non-reinforced materials (resin-coated foil or polyimide), there is a ProVia model to meet your requirements.

Industry 4.0

Applications

Blind Via Drilling

Through-hole Via Drilling

Buried Via Drilling

Cutting, Routing, Patterning

Circuit Excising

Skiving

Cavity Formation

Defect Repair