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The Benefits of Dual Laser Microvia Drilling

The drive for smaller but high-functionality handheld devices led to the implementation of laser-drilled microvias over 20 years ago. Laser drilling of vias is now an established process in the PCB industry for many different circuit applications. Two laser types and three main methods are in use: UV laser drilling only; CO2 laser drilling only; and a combination of both the UV and CO2, commonly referred to as the hybrid process. This hybrid process provides the greatest opportunity for process optimization in the widest range of materials.

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flying probe tester

Laser Resistor Trimming Test Options

When a printed circuit board, hybrid circuit or component is assembled, testing will occur using a variety of methods which include flying probes, probe cards, pogo pins or other custom testing options …

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robotics

Industry 4.0 and the Smart Factory

Industry 4.0 refers to a new stage in the Industrial Revolution which focuses on smart and autonomous systems fueled by data and machine learning. Sometimes referred to as Industry Internet of Things (IIoT) or smart manufacturing …

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